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High Throughput Microfluidic rapido ed economico prototipazione metodi a basso Packaging
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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High Throughput Microfluidic rapido ed economico prototipazione metodi a basso Packaging

DOI:
10.3791/50735-v

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07:51 min

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December 23, 2013

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,
1Electrical Engineering Department,Polytechnique Montreal

Chapitres

  • 00:05Titre
  • 01:10Interconnector Fabrication
  • 04:12Assembly and Disassembly of Reusable Microfluidic Chips with an Electrical Interface
  • 06:21Results: Comparison of Interconnectors for Rapid Prototyping
  • 07:29Conclusion

Summary

Traduction automatique

Traduction automatique

In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.

Tags

Keywords: MicrofluidicPackagingPrototypingOne-time UseReusableUV EpoxyTemperature CuringWire-bondingSilver EpoxyPDMSAnisotropic AdhesivePlexiglasMicromanipulatorLow PressureHigh PressurePlasma-oxygen

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