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Laser-induceret Forward Transfer for Flip-chip Pakning af Single Dies
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Journal JoVE Ingénierie
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
DOI:

08:21 min

March 20, 2015

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Chapitres

  • 00:05Titre
  • 01:48Micro-bumping Using Laser-induced Forward Transfer
  • 03:52Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly
  • 05:23Characterization of the Bonded Vertical-cavity Surface-emitting Lasers
  • 06:28Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip
  • 07:50Conclusion

Summary

Traduction automatique

Vi demonstrere brugen af ​​Laser-induceret Forward Transfer (LIFT) teknik til flip-chip samling af optoelektroniske komponenter. Denne fremgangsmåde giver en enkel, omkostningseffektiv, lav temperatur, hurtig og fleksibel løsning for fine pitch bumpe og limning på chip-skala for at opnå høj tæthed kredsløb til optoelektroniske applikationer.

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