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Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
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Journal JoVE Ingénierie
Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

DOI:
10.3791/55175-v

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04:54 min

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January 17, 2017

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, ,
1Department of Mechanical & Industrial Engineering,University of Toronto, 2Institute of Biomaterials and Biomedical Engineering (IBBME),University of Toronto

Chapitres

  • 00:05Titre
  • 00:41Preparation of Thermodynamic Microfluidic Device Layers
  • 01:39Solvent Bonding
  • 03:14Results: Visual Examples of Bonding Process
  • 04:12Conclusion

Summary

Traduction automatique

Traduction automatique

Solvent bonding is a simple and versatile method for fabricating thermoplastic microfluidic devices with high quality bonds. We describe a protocol to achieve strong, optically clear bonds in PMMA and COP microfluidic devices that preserve microfeature details, by a judicious combination of pressure, temperature, an appropriate solvent, and device geometry.

Tags

Keywords: Solvent BondingPMMACOPMicrofluidic DevicesThermoplasticDevice FabricationMicrofluidic Cell CulturePoint-of-care DiagnosticsLayer BondingVisual InspectionSolvent ApplicationBubble RemovalLayer AlignmentHeated Press

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