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Localized Bathless Metal-Composite Plating via Electrostamping
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Localized Bathless Metal-Composite Plating via Electrostamping

Localized Bathless Metal-Composite Plating via Electrostamping

DOI:
10.3791/61484-v

•

08:05 min

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September 22, 2020

•

, , ,
1Department of Chemistry and Biochemistry,St. Mary’s College of Maryland, 2PMA-265 Power and Propulsion IPTL

Chapitres

  • 00:05Introduction
  • 00:47Preparing Coating Salts
  • 01:56Preparing the Electrodes
  • 03:10Assembly and Coating
  • 05:03Characterization with Electrochemistry
  • 06:07Results: Morphological and Electrochemical Analysis of the Metal-Composite Deposition
  • 07:16Conclusion

Summary

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Presented here is a protocol of bathless electroplating, where a stagnant metal salt paste containing composite particles are reduced to form metal composites at high loading. This method addresses the challenges faced by other common forms of electroplating (jet, brush, bath) of embedding composites particles into the metal matrix.

Tags

ElectroplatingElectrostampingMetal-composite CoatingFluorescent CoatingNickel SulfateNickel ChlorideBoric AcidEuropiumDysprosiumStrontium AluminateYttrium OxideBarium Magnesium AluminateAnodeCathodePotassium HydroxideSodium HydroxideAcid ActivationCurrent Efficiency

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