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Bioengineering

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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
 
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Article DOI: 10.3791/50735-v 07:51 min December 23rd, 2013
December 23rd, 2013

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In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.

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Keywords: Microfluidic Packaging Prototyping One-time Use Reusable UV Epoxy Temperature Curing Wire-bonding Silver Epoxy PDMS Anisotropic Adhesive Plexiglas Micromanipulator Low Pressure High Pressure Plasma-oxygen
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