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1Department of Mechanical Engineering,University of Hong Kong, 2Department of Mechanical Engineering,University of Michigan, 3Department of Electrical Engineering and Computer Science,University of Michigan, 4Department of Chemistry,University of Hong Kong, 5HKU-Shenzhen Institute of Research and Innovation
Chapters
- 00:05Title
- 01:27Photolithography-based Fabrication of an Embedded Metal-mesh Transparent Electrode (EMTE)
- 05:14Electron-beam Lithography-based Fabrication of a Sub-micron EMTE
- 07:44EMTE Characterization
- 08:33Results: EMTE Fabrication by the Lithography, Electroplating, and Imprint Transfer (LEIT) Method
- 10:05Conclusion
Detta protokoll beskriver en lösningsbaserad tillverkningsstrategi för högpresterande, flexibla, transparenta elektroder med fullt inbäddad tjock metallnät. Flexibla transparenta elektroder som tillverkas med detta förfarande visar bland de högst rapporterade prestanda, inklusive resistens mot extremt lågt ark, hög optisk transmittans, mekanisk stabilitet under böjning, starkt substratvidhäftning, ythaltighet och miljöstabilitet.
