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金属辅助多孔硅和固体硅晶圆的电化学纳米压印

JoVE 신문
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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers

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金属辅助多孔硅和固体硅晶圆的电化学纳米压印

DOI:

10.3791/61040-v

•

09:18 min

•

February 08, 2022

•

Aliaksandr Sharstniou, Stanislau Niauzorau, Ashlesha Junghare, Bruno P. Azeredo

¹The Polytechnic School,Arizona State University

Chapters

00:05Introduction
01:19Mac-imprint Stamp Preparation
02:43Photoresist Ultraviolet (UV) Nanoimprinting
04:05Gold and Silver/Gold Catalyst Thin Film Deposition
05:17Silver/Gold Catalyst Thin Film Dealloying
06:01Mac-imprint Operation
07:33Results: Representative Au Porous Stamp and Si Mac-imprint Imaging
08:31Conclusion

Summary

자동 번역

提出了一种金属辅助化学印迹的方案，将形状精度低于20 nm的3D微尺度特征印制到固体和多孔硅晶圆中。

Tags

Metal-assisted Electrochemical Nanoimprinting Porous Silicon Solid Silicon Hierarchical Microstructures Metasurface-based Microoptic Elements Waveguide Technologies Optical Biosensors Infrared Optical Devices III-V Semiconductors Stamp To Substrate Tip And Tilt Alignment RCA-1 Solution PFOCS PDMS UV Nanoimprinting

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