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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

DOI:
10.3791/61468-v

•

09:06 min

•

July 03, 2020

•

, , , , ,
1Escola Politécnica Superior,Universidade da Coruña

Chapters

  • 00:05Introduction
  • 00:41Manufacturer Curing Condition Checking: Thermogravimetric Cured Sample Testing
  • 01:20Manufacturer Curing Condition Checking: Differential Scanning Calorimetry (DSC) of a Cured Sample
  • 02:29DSC Fresh Sample Analysis: Ramp Curing Test
  • 03:23DSC Fresh Sample Analysis: Isothermal Curing Test
  • 04:47Logarithmic Strain Sweep Test
  • 05:27Isothermal Multifrequency Curing Test
  • 06:22Torque sweep and Temperature Scan Testing
  • 07:18Results: Representative Cured Adhesive System Rheological and Thermal Testing
  • 08:42Conclusion

Summary

자동 번역

자동 번역

An experimental methodology based on thermal and rheological measurements is proposed to characterize the curing process of adhesives with to obtain useful information for industrial adhesive selection.

Tags

Keywords: Adhesive SystemsCuring ProcessRheological TestingThermal AnalysisThermogravimetric AnalysisDifferential Scanning CalorimetryQuality ControlAdhesive SelectionCuring StudyHeating-cooling-heating Test

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