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流变和热测试对粘合系统固化的评价
JoVE 신문
공학
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JoVE 신문 공학
Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
DOI:

09:06 min

July 03, 2020

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Chapters

  • 00:05Introduction
  • 00:41Manufacturer Curing Condition Checking: Thermogravimetric Cured Sample Testing
  • 01:20Manufacturer Curing Condition Checking: Differential Scanning Calorimetry (DSC) of a Cured Sample
  • 02:29DSC Fresh Sample Analysis: Ramp Curing Test
  • 03:23DSC Fresh Sample Analysis: Isothermal Curing Test
  • 04:47Logarithmic Strain Sweep Test
  • 05:27Isothermal Multifrequency Curing Test
  • 06:22Torque sweep and Temperature Scan Testing
  • 07:18Results: Representative Cured Adhesive System Rheological and Thermal Testing
  • 08:42Conclusion

Summary

자동 번역

提出了一种基于热和流变测量的实验方法,用于描述粘合剂的固化过程,为工业胶粘剂的选择获取有用的信息。

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