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A High-Throughput Platform for Culture and 3D Imaging of Organoids
JoVE 신문
생물학
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JoVE 신문 생물학
A High-Throughput Platform for Culture and 3D Imaging of Organoids
DOI:

07:42 min

October 14, 2022

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Chapters

  • 00:04Introduction
  • 00:49PDMS Mold Dicing and Production of the UV‐Curable, Adhesive, Textured Layer
  • 02:19Coverslip Substrate Preparation
  • 03:34Transferring the Textured Film to the Final Substrate
  • 04:33Cell Seeding, Release, and Collection of the Organoids
  • 06:29Results: Fabrication of the Microwell Culture Dish for a High‐Density Organoid Culture and Differentiation
  • 07:00Conclusion

Summary

자동 번역

This paper presents a fabrication protocol for a new type of culture substrate with hundreds of microcontainers per mm2, in which organoids can be cultured and observed using high-resolution microscopy. The cell seeding and immunostaining protocols are also detailed.

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