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Bonding solvente per la fabbricazione di PMMA e COP dispositivi microfluidici
JoVE Journal
Ingegneria
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JoVE Journal Ingegneria
Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
DOI:

04:54 min

January 17, 2017

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Capitoli

  • 00:05Titolo
  • 00:41Preparation of Thermodynamic Microfluidic Device Layers
  • 01:39Solvent Bonding
  • 03:14Results: Visual Examples of Bonding Process
  • 04:12Conclusion

Summary

Traduzione automatica

Solvent bonding is a simple and versatile method for fabricating thermoplastic microfluidic devices with high quality bonds. We describe a protocol to achieve strong, optically clear bonds in PMMA and COP microfluidic devices that preserve microfeature details, by a judicious combination of pressure, temperature, an appropriate solvent, and device geometry.

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