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Chapters
- 00:05Introduction
- 00:41Substrate Preparation
- 01:21Specimen Preparation
- 02:08Equipment Operability
- 02:55Specimen Bonding
- 03:34Final Strength Data
- 04:51Kinetic Strength Development
- 05:56Heat Resistance and Failed Bonding Surface Image Analysis
- 07:12Results: Representative Protein Adhesion Analyses
- 08:06Conclusion
We present a procedure, ASTM D7998-19, for a rapid and more consistent evaluation of both dry and wet strength of adhesive bonds on wood. The method can also be used to provide information on strength development as a function of temperature and time or strength retention up to 250 °C.
