任意基底上共轭聚合物薄膜的反应气相沉积
Summary
本文介绍了在玻片和粗糙衬底上的聚 (34-吩)、聚 (34-propylenedioxythiophene) 和聚 (2,3-c [32-b] 噻吩) 薄膜的活性气相沉积的协议, 如纺织品和纸张。
Abstract
我们演示了一种形涂层共轭聚合物在任意基底上使用定制设计的低压反应室的方法。导电聚合物, 聚 (34-吩) (PEDOT) 和聚 (34-propylenedioxythiophene) (PProDOT), 和一个半导体聚合物, 聚 (2,3-c [32-b] 噻吩) (PTT), 沉积在非传统的高度无序和具有高表面积的纹理基质, 如纸、毛巾和织物。这一报告的沉积室是以前的蒸气反应堆的改进, 因为我们的系统可以同时容纳挥发性和非挥发单体, 如 34-propylenedioxythiophene 和 2,3-c [32-b] 噻吩。同时也证明了固体和液态氧化剂的利用。这种方法的一个局限性是它缺乏复杂的原位厚度监视器。通常采用的解决涂层方法 (如自旋涂层和表面接枝) 所制成的聚合物涂层通常不均匀或易受机械降解的影响。这种报告的气相沉积方法克服了这些缺点, 是一种很强的替代普通解决涂层方法。值得注意的是, 被报道的方法涂覆的聚合物薄膜在粗糙表面上是均匀和共形的, 即使在微米尺度上也是如此。这一特性允许在柔性和高质感的基板上应用蒸汽沉积聚合物在电子设备上。
Introduction
聚合物导电和半导体材料具有独特的特性, 如灵活性1、拉伸2、透明3和低密度、4 , 它为创建下一代电子设备在非传统的基板上。目前, 许多研究人员正在努力利用高分子材料的独特特性来创造灵活和/或耐磨的电子产品5,6和智能纺织品7。然而, 形涂层的能力高纹理表面和 non-robust 基板, 如纸张, 织物和线程/纱线, 仍然 unmastered。最常见的是, 用溶液方法合成和涂覆在表面的聚合物。8,9,10,11,12虽然解决方法提供了聚合物涂层纤维/纺织品, 但由此获得的涂层通常不均匀, 容易受到小物理应力的破坏13,14 。由于润湿问题, 解决方法也不适用于涂布纸。
活性气相沉积可以在不同的基底上产生共形共轭聚合物膜, 无论表面化学/成分, 表面能和表面粗糙度/地形15。在这种方法中, 共轭聚合物在蒸汽相中合成, 同时将单体和氧化剂蒸气输送到表面。聚合和膜的形成发生在一个单一的, 无溶剂的步骤表面。这种方法在理论上适用于任何可以用溶液法合成的共轭聚合物。然而, 到目前为止, 只存放一组狭窄的共轭聚合物结构的协议是已知的。15
在这里, 我们演示了导电聚 (34-吩) (PEDOT) 和聚 (34-propylenedioxythiophene) (PProDOT), 和半导体聚 (2,3-c [32-b] 噻吩) (PTT) 薄膜通过反应气相沉积。两种氧化剂, 固体 FeCl3和液体 Br2, 在该过程中使用。相应的聚合物被命名为 PProDOT、cl-PTT 和 Br-PEDOT。传统的基板, 玻璃幻灯片, 和非传统的纹理基板, 如纸, 毛巾和织物, 都涂上了聚合物薄膜。
本协议描述了 custom-built 气相沉积室的设置和沉积过程的细节。它的目的是帮助新的从业者建立他们的沉积系统, 避免与气相合成相关的常见缺陷。
Protocol
Representative Results
Discussion
反应的机理是氧化聚合。采用相同机理的聚合物涂层方法包括聚合17和气相聚合法18。聚合需要导电衬底, 缺乏均匀和保形涂层的优势, 是一种环境不友好的解决方法19。现有的气相聚合方法与这里所报道的方法相似, 但只能聚合高挥发性单体20。我们的方法改进了现有方法的腔室设计, 不仅能聚合高挥发性单体, 而且还能不稳定?…
Disclosures
The authors have nothing to disclose.
Acknowledgements
作者衷心感谢美国空军科研办公室在协议编号 FA9550-14-1-0128 的资助。t.l.a. 还衷心感谢大卫和露西尔基金会的部分支持。
Materials
| 3,4-Ethylenedioxythiophene, 97% | Sigma Aldrich | 483028 | |
| 3,4-Propylenedioxythiophene, 97% | Sigma Aldrich | 660485 | |
| Thieno[3,2-b]thiophene, 95% | Sigma Aldrich | 702668 | |
| FeCl3, 97% | Sigma Aldrich | 157740 | |
| Br2 | Sigma Aldrich | 207888 |
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