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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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JoVE Journal Engineering
Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

DOI:
10.3791/53683-v

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08:46 min

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April 13, 2016

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, , , , , ,
1Materials Engineering Division,Lawrence Livermore National Laboratory, 2Assembly Test and Technology Development Failure Analysis Labs,Intel Corporation, 3Advanced Light Source,Lawrence Berkeley National Laboratory

Chapters

  • 00:05Title
  • 01:28Steps for Performing Tomography Scans at Beamline 8.3.2 (ALS, LBNL)
  • 04:02Setting up the Scan Parameters Using the Data Acquisition Computer
  • 04:54Results: Multi-scale Features Imaged in an Entire Micro-electronic Package Using Synchrotron Radiation Microtomography
  • 06:11Conclusion

Summary

Automatic Translation

Automatic Translation

For this study synchrotron radiation micro-tomography, a non-destructive three-dimensional imaging technique, is employed to investigate an entire microelectronic package with a cross-sectional area of 16 x 16 mm. Due to the synchrotron's high flux and brightness the sample was imaged in just 3 min with an 8.7 µm spatial resolution.

Tags

Synchrotron Radiation Microtomography3D ImagingMicroelectronic PackageNon-destructive EvaluationMicrometer ScaleSample MountingSample AlignmentMagnification SelectionX-ray EnergyPolychromatic Beam

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