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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
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Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers

Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers

DOI:
10.3791/61040-v

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09:18 min

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February 08, 2022

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, , ,
1The Polytechnic School,Arizona State University

Chapters

  • 00:05Introduction
  • 01:19Mac-imprint Stamp Preparation
  • 02:43Photoresist Ultraviolet (UV) Nanoimprinting
  • 04:05Gold and Silver/Gold Catalyst Thin Film Deposition
  • 05:17Silver/Gold Catalyst Thin Film Dealloying
  • 06:01Mac-imprint Operation
  • 07:33Results: Representative Au Porous Stamp and Si Mac-imprint Imaging
  • 08:31Conclusion

Summary

자동 번역

자동 번역

A protocol for metal-assisted chemical imprinting of 3D microscale features with sub-20 nm shape accuracy into solid and porous silicon wafers is presented.

Tags

Metal-assisted Electrochemical NanoimprintingPorous SiliconSolid SiliconHierarchical MicrostructuresMetasurface-based Microoptic ElementsWaveguide TechnologiesOptical BiosensorsInfrared Optical DevicesIII-V SemiconductorsStamp To Substrate Tip And Tilt AlignmentRCA-1 SolutionPFOCSPDMSUV Nanoimprinting

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