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Bonding solvente per la fabbricazione di PMMA e COP dispositivi microfluidici
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Kapitel
- 00:05Titel
- 00:41Preparation of Thermodynamic Microfluidic Device Layers
- 01:39Solvent Bonding
- 03:14Results: Visual Examples of Bonding Process
- 04:12Conclusion
Solvent bonding is a simple and versatile method for fabricating thermoplastic microfluidic devices with high quality bonds. We describe a protocol to achieve strong, optically clear bonds in PMMA and COP microfluidic devices that preserve microfeature details, by a judicious combination of pressure, temperature, an appropriate solvent, and device geometry.
