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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
 

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Article DOI: 10.3791/53683-v • 08:46 min • April 13th, 2016
April 13th, 2016 •
1, 1, 2, 2, 2, 3, 3
1Materials Engineering Division, Lawrence Livermore National Laboratory, 2Assembly Test and Technology Development Failure Analysis Labs, Intel Corporation, 3Advanced Light Source, Lawrence Berkeley National Laboratory

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For this study synchrotron radiation micro-tomography, a non-destructive three-dimensional imaging technique, is employed to investigate an entire microelectronic package with a cross-sectional area of 16 x 16 mm. Due to the synchrotron's high flux and brightness the sample was imaged in just 3 min with an 8.7 µm spatial resolution.

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Synchrotron Radiation Microtomography Three-dimensional Imaging Microelectronic Packages Non-destructive Technique Resolution Image Quality Data Acquisition Time Maker Tomography Beam Line Advanced Light Source Berkeley California Semiconductor Field Electronic Packages Reliability Test Process Development Experimental Flexibility X-ray Source Defects Sample Holder
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